Technology

Powering Up Panel-Level Packaging! Capcon’s Die Bonder Wins Bulk Adoption by Internationally Leading IDM Giant

Recently, Capcon’s large panel-level packaging die bonder, AvantGo L6 (Leo), has been adopted in bulk by an Internationally Leading IDM manufacturer and mass producer. It […]

Estimated read time 3 min read
Technology

ELFLIQ, Unlimited Inspiration

ELFLIQ, we don’t simply tone down the flavor’s potency; we take it to a new level! We go beyond just reducing the intensity of the […]

Estimated read time 4 min read